Providing Interconnection Solutions Through Innovative Products
At MPCS we blend experienced personnel and process controls with advanced equipment to support the wide variety of products demanded by our broad client base. Below is a sampling of what we do:
Printed Circuit Board Features:
Through Hole and Surface Mount
SMD Pitch Size to .008
BGA and µBGA Technology
Lead Free
Buried Vias
Blind Vias
Via size to .004"
Lines/Space to .003"
Via in Pad
Metal Core Boards
Heat Sink Boards
LPI and Dry Film Solder Mask
NASA – Meets or Exceeds Out-gassing Requirements
Peelable Solder Mask
Raised Profile Plating
Sequential Lamination and Controlled Depth Drill/Plating Capability
Controlled Impedance (+/- 10% standard)
Copper Weights up to 11 ounce
High Speed Epoxy / Teflon Hybrids
RF Applications
Mixed Copper Weights
Material Solutions - Laminates and Combination Materials:
The following are some of the laminates that Midwest Printed Circuits uses as a standard process or are in the R&D stage. Because of the ever changing demands placed upon the printed circuit board by technology, alternative materials are being used to fabricate today's high performance printed boards. Where once designs were built out of "pure" laminates, such as FR4 or Polyimide, today's boards may utilize a combination of materials. These leading edge boards are known as "hybrids". Please contact Midwest Printed Circuit Services at mpcs@midwestpcb.com for details on the hybrid materials we utilize.
FR4 – 370HR
Hybrids
Getek
FR408
BT Epoxy
Polyimide
Thermagon
Teflon/Duroid/PTFE
Surface Finishes and Plating:
HASL (Hot Air Leveling)
Lead Free Solder
Immersion Nickel / Gold
Heavy Gold
Deep Nickel Gold
Gold Tip Plating
OSP
SIPAD
Silver
White Tin
Carbon / Conductive Inks
Copper Plating Ceramic Substrates
For plated through hole boards, electroless copper is followed by electroplated copper. The electroplated copper is deposited onto the hole wall to an average thickness of 0.001 inch. During the plating process, external lines receive an average of 0.0012 inch of copper plating. This is in addition to the original (base) copper foil. All exposed circuitry after soldermask needs to be protected by one of the finishes listed below.
Hot Air Leveled Solder - HASL (Eutectic: 63% Tin - 37% Lead)
• Typical coating thickness: 30 µinch to 200 µinch, design dependent
• Excellent solderability
• 0.020 inch pitch capability
• 0.030 inch minimum board thickness capability
• Good shelf life
Hot Air Leveled - Lead Free
• Typical coating thickness: 30 µinch to 200 µinch, design dependent
• Good solderability
• 0.020 inch pitch capability
• 0.030 inch minimum board thickness capability
• Good shelf life
Tin Plating
• Typical thickness: 300 µinch tin
• Solderable surface
• Fair shelf life
Deep Nickel Plating
• Typical thickness: 200 µinch nickel
• Excellent corrosion resistance
• Excellent wear resistance, best for surface switches, on/off contacts
• Excellent shelf life
Automatic Gold Plating - Tabs
• Typical thickness: 30 to 50 µinch gold (99.7% Pure) over 200 µinch nickel
• Excellent corrosion resistance
• 130 to 220 Knoop hardness
• Excellent wear resistance, best for edge connectors
• Excellent shelf life
Electroless Nickel / Immersion Gold (99.9% Pure Gold)
• Typical thickness: 3 to 8 µinch gold over 100 µinch nickel
• Excellent corrosion resistance
• Good for aluminum wire bonding
• Excellent for fine pitch technology
• Board not subjected to thermal shock (such as HASL)
• Excellent solderability
• Excellent shelf life
Organic Solderability Preservative (OSP) or Anti-Tarnish
• Typical coating thickness: 8 µinch
• Good solderability
• Excellent surface coplanarity and hole size uniformity
• Used in fine pitch technology
• Board not subjected to thermal shock (such as HASL)
• Fair shelf life (12 months)
Thermal Management Solutions:
Heat sinks: Aluminum and Copper
Metal Core boards: Aluminum , Copper, frame bonding
Thermagon Construction: 10x Thermally Conductive Substrates and Prepregs
In-House Highlights and Testing Capabilities:
Laser Direct Imaging
Inkjet Printer for Legend, Serialization and Traceability
Completely Automated CAM Stations
Flying Probe Net List Testing
Clam Shell Testing
Automatic Optical Inspection with CAM Interface
LPI Soldermask
Dry Film Soldermask
Ionic Contamination Testing
Micro-Sectioning Lab
Complete Chemistry Lab
Atomic Absorption Photo Spectrometry
Cross Section Analysis
